Panasonic Megtron6 (M6) R-5775 PCB – High-Speed, Low-Loss Multilayer PCB for 5G, Automotive, and High-Performance Computing

1.Overview:

Explore the advanced Panasonic Megtron6 (M6) R-5775 laminate, a premier multilayer copper-clad laminate (CCL) engineered for high-frequency, high-speed, and dependable electronic applications. Ideal for 5G communications, millimeter-wave radar, high-speed servers, and high-performance computing (HPC), M6 stands out with its remarkably low dielectric loss (Df), stable dielectric constant (Dk), and superior thermal reliability, perfectly addressing the rigorous demands of modern high-frequency signal transmission.

2.Key Features:

Dielectric Constant: 3.4 at 1GHz/23°C; 3.34 at 13GHz
Dissipation Factor: 0.002 at 1GHz/23°C; 0.0037 at 13GHz
Thermal Properties: High Tg value exceeding 185°C and thermal decomposition temperature of 410°C
Design Flexibility: Supports multilayer PCB designs ranging from 4 to 30 layers, accommodating complex circuit requirements
Eco-Friendly Manufacturing: Complies with RoHS and halogen-free standards, aligning with green manufacturing practices
Cost-Effective Processing: Compatible with traditional FR-4 technology, eliminating the need for special equipment and reducing production costs
Flammability Rating: UL 94V-0 certified

3.PCB Stackup: 16-layer rigid PCB

Copper_layer_1 - 35 μm
Prepreg R-5670(G) 1080 X 1 - 85.1μm
Copper_layer_2 - 17 μm

M6 Core R5775G(HVLP) 96 μm
Copper_layer_3 - 17 μm
Prepreg R-5670(G) 3313 X 1 - 99.4μm
Copper_layer_4 - 17 μm

M6 Core R5775G(HVLP) 96 μm
Copper_layer_5 - 17 μm
Prepreg R-5670(G) 3313 X 1 - 99.4μm
Copper_layer_6 - 17 μm

M6 Core R5775G(HVLP) 96 μm
Copper_layer_7 - 35 μm
Prepreg R-5670(G) 3313 X 1 - 99.4μm
Copper_layer_8 - 35 μm

M6 Core R5775G(HVLP) 96 μm
Copper_layer_9 - 17 μm
Prepreg R-5670(G) 3313 X 1 - 99.4μm
Copper_layer_10 - 17 μm

M6 Core R5775G(HVLP) 96 μm
Copper_layer_11 - 17 μm
Prepreg R-5670(G) 3313 X 1 - 99.4μm
Copper_layer_12 - 17 μm

M6 Core R5775G(HVLP) 96 μm
Copper_layer_13 - 17 μm
Prepreg R-5670(G) 3313 X 1 - 99.4μmB
Copper_layer_14 - 17 μm

M6 Core R5775G(HVLP) 96 μm
Copper_layer_15 - 17 μm
Prepreg R-5670(G) 1080 X 1 - 85.1μm
Copper_layer_16 - 35 μm

4.PCB Construction details:

- Board dimensions: 110 mm x 110 mm=1PCS, +/- 0.15mm
- Minimum Trace/Space: 3/4 mils
- Minimum Hole Size: 0.2mm
- No Blind vias.
- Finished board thickness: 2.0mm
- Finished Cu weight: 1oz (1.4 mils) outer layers, 0.5oz /1oz inner layers
- Via plating thickness: 25 μm
- Surface finish: Electroless Nickle Immersion Gold (ENIG)
- Top Silkscreen: White
- Bottom Silkscreen: White
- Top Solder Mask: Green
- Bottom Solder Mask: Green
- 0.2mm via filled and capped
- 100% Electrical test used prior to shipment

5.Impedance Control:

Single-end, L1 11.8mil, 75ohm, reference layer 4
Single-end, L1, 5.9mil, 50 ohm, reference layer 2
Single-end, L16, 5.9mil, 50 ohm, reference layer 15
Differential, L1, 5.9mil/7.87mil, 100 ohm, reference layer 2
Differential, L10, 3.94mil/5.9mil, 100 ohm, reference layer 9
Differential, L12, 3.94mil/5.9mil, 100 ohm, reference layer 11, layer 13

6.PCB Statistics:

Components: 154
Total Pads: 406
Thru Hole Pads: 137
Top SMT Pads: 121
Bottom SMT Pads: 148
Vias: 532
Nets: 9

7.Type of artwork supplied:

Gerber RS-274-X

8.Quality standard:

IPC-Class-2

9.Global Availability:

Megtron6 (M6) PCBs are available worldwide, ready to elevate your electronic projects.

10.Typical Applications:

5G Communication Base Stations: Millimeter-wave antennas and RF front-ends for AAUs (Active Antenna Units)
Automotive Electronics: 77GHz millimeter-wave radar for Advanced Driver Assistance Systems (ADAS)
Data Centers: High-speed server motherboards and 400G/800G optical module PCBs
Aerospace: High-frequency circuit boards for satellite communication and radar systems
Consumer Electronics: High-frequency Wi-Fi 6E/7 routers and AR/VR devices